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Dai Weimin: Vice Chairman of IC Design Branch of China Semiconductor Industry Association

[Wonderful view] Songshan Lake had missed the opportunity to host an annual China Integrated Circuit Conference, but the Songshan Lake China IC Innovation Summit Forum has been held for nine sessions. The Songshan Lake China IC Innovation Summit Forum has not only vigorously promoted local IC new products, It also greatly promoted the Songshan Lake brand and played a role in attracting investment. In the 7 years from 2012 to 2018, the Summit Forum introduced 59 new chips, of which 53 were mass-produced chips, with a total yield of 90%.

Song Tao: Advisor to the People's Government of Dongguan

[Wonderful view] The summit forum has been successfully held for nine years, and the future is the next nine years. I believe that local ICs will be better in the future. In the past nine years, driven by the Songshan Lake China IC Innovation Summit Forum, Songshan Lake has now settled in more than 50 IC design companies, and the industrial agglomeration effect has already appeared. At present, the park has been formed driven by leading companies in subdivided fields. A group of promising start-ups have jointly promoted the park's integrated circuit design industry pattern, and the industrial atmosphere is getting stronger and stronger.

[Electronic Innovation Network Zhang Guobin] The Songshan Lake China IC Innovation Summit Forum, which mainly promotes local innovation ICs, has been held for nine sessions. In the past two years, the summit forum has encountered a climax of Sino-US trade disputes. The eighth Songshan Lake China IC Innovation Summit was held at the time of ZTE ’s embargo. This year, it encountered another US government ban on Huawei. From the perspective of the development of these two years, the Sino-US trade dispute has been prolonged trend. In this context, local ICs must be bigger and stronger. The theme of this year's summit forum is smart home. This market has been catalysed for many years and has reached the zero point of the outbreak. Technology has subtlely penetrated our lives. Every home now has several smart products, and there will be more smart home products in the future. Around this market, local ICs have initially possessed the capabilities of the entire smart home industry chain. Among the products introduced this year, there are face recognition solutions, connection solutions, Bluetooth solutions, RF solutions, sensor solutions, power management solutions, etc. required for smart homes, which can be said to be both differentiated and personalized. Our special topic will introduce the introduced products in detail. If you have time to read the previous Songshan Lake China Innovation IC topic, you can see a development path of China Core from following to gradually surpassing. At the 2019 Songshan Lake China IC Innovation Summit Forum, we will present the forum information in an all-round way through text, pictures, videos and other information. We want to let more people know about local innovative IC products, and welcome everyone to express their opinions on the development of local IC. Please email me at richard@lopesgs.com, thank you.

Dai Weimin Song Tao Wang Jun Liu Occupy
Vice Chairman of IC Design Branch of China Semiconductor Industry Association Adviser of Dongguan Municipal People's Government Hangzhou Xiongmai CEO Deputy General Manager of Xinlian
Niu Zhao Xu Gang Huang Xin Fan Xiang
Vice President of Furuikun General Manager of Shanghai Juwei Han Tianxia Vice President of Strategic Development Senior Director of Market and Application
Jiang Yanbo Liu Zhizhi Dyshenko Chen Hui
Sai Weiwei, General Manager Nasda SoC Product Director General Manager of Weiyuan Semiconductor Senior Product Marketing Director of Zhaoyi Innovative Storage Division
Roundtable Forum Topics

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A bit silly smart speaker said: this house appliances are difficult to bring

[Interaction Question]

1. Who will lead the development of the smart home industry?

Second, the next generation of smart speakers with a display or a projector?

Third, the smart home landing scene

Fourth, the main obstacles to the development of the smart home market?

Fifth, the real outbreak of smart home?

Speech by Dai Weimin, Vice Chairman of IC Design Branch of China Semiconductor Industry Association

Song Tao, Consultant of Dongguan Municipal People's Government

Hangzhou Xiongmai Wang Jun introduced Xm530ai:
A smart IoT video processing chip that supports face detection

Xin Zhilian Liu Occupation introduced XR808:
Very low power consumption for IoT
Wi-Fi MCU chip

Furui Kun Niu Zhao introduced FR8028:
The first in China to support the BLE5.1 protocol and support
Bluetooth Low Energy SoC with RSIC-V instruction set

Shanghai Juwei Xu Gang introduced MG126:
Universal BLE RF transceiver front-end chip

Han Tianxia Huang Xin introduced HS8018-31:
Ultra-low-voltage NB-IoT RF front-end chip

Si Rui Fan Xiang introduced QMI7602:
Industry's first integrated sensor chip with integrated 6-axis IMU and GPS / BeiDou satellite positioning function

Sai Weiwei Jiang Yanbo introduced CW6305:
Charge management chip for IoT / wearable / earphone devices

Nasda Liu Zhizhi introduced SCS23X:
Low-power IPSeC network communication security chip for IoT

Micro-Source Semiconductor Daixing Branch Introduces LP6288QVF: 4K / 8K FHD
Panel power management chip

Zhaoyi Innovation Chen Hui introduces GD25LX256E: the first domestic high-speed 8-port SPI NOR Flash